How many wafers are in a 300mm FOUP?
Pitch for 300mm Foup is 10mm. While 13 slot pitch can be up to 19mm but only 13 wafers To allow this, each FOUP has various coupling plates, pins and holes to allow the FOUP to be located on a load port, and to be manipulated by the AMHS (Automated Material Handling System).
How many wafers are in a FOUP?
25 wafers
In most semiconductor companies wafers travel through 300-mm wafer fabs in FOUPs containing a maxi- mum of 25 wafers. Due to the increase in wafer size, a FOUP full of 300-mm wafers can weigh in excess of 40 pounds.
What is FOUP in semiconductor?
FOUP（読み方：Front-Opening Unified Pod）
Abbreviation for Front-Opening Unified Pod. An enclosed container for transporting and storing wafers or glass carriers to another process in a semiconductor factory.
What is a wafer pod?
Wafer SMIF Pod is able to load Cassette with wafers inside, provide protection to wafers during delivery and storage between process and process.
How many chips fit on a 300mm wafer?
For info, around 600 A13 chips fit on a 300mm wafer.
What are 300mm chips used for?
For the most part, 300mm wafers are used in high-volume, commodity chips including DRAMs, flash memory and microprocessors. Very recently, some image sensors, power management devices, complex logic and microcomponent ICs with large die sizes have been produced on 300 mm wafers, according to IC Insights.
What is a FOUP load port?
FOUP Load Port: Introduction
It is a specialized plastic enclosure device which is designed to hold silicon wafers securely and safely in a controlled environment.
How do you pronounce Foup?
Pronunciation
- IPA: /fuːp/
- Audio (US) 0:01. (file)
- Rhymes: -uːp.
Who makes FOUPs?
Shin-Etsu Polymer’s
Shin-Etsu Polymer’s FOSBs and FOUPs are known for their high quality and reliability in the global semiconductor industry.
What are 300 mm wafers used for?
The latest semiconductor production lines today use 300 mm wafers for logic/memory chips and for analog devices. In contrast, production lines built in the 1980s and 1990s use 6- and 8-inch wafers, and there are some older production lines that still use 4-inch wafers.
How big is a 300mm wafer?
11.8 inch
Silicon
| Wafer size | Typical thickness | Weight per wafer |
|---|---|---|
| 150 mm (5.9 inch, usually referred to as “6 inch”) | 675 μm | |
| 200 mm (7.9 inch, usually referred to as “8 inch”) | 725 μm. | 53 grams |
| 300 mm (11.8 inch, usually referred to as “12 inch”) | 775 μm | 125 grams |
| 450 mm (17.7 inch) (proposed) | 925 μm | 342 grams |
How many dies on a 300mm wafer?
A NAND wafer is circular, 300mm in diameter, and holds a maximum of 700 dies. At the 200+ layer level these would be 512Gb dies in Samsung’s case. A wafer would hold 700 x 512Gb = 358,400Gb, which adds up to 44,800GB or 44.8TB.
What is difference between FOSB and Foup?
The wafer carrier box used in moving from a wafer manufacturer to a semiconductor manufacturer is called a Front Opening Shipping Box (FOSB), and a carrier box used in a semiconductor manufacturing process line is called a Front Opening Unified Pod (FOUP).
What does 300mm wafer mean?
A 300mm wafer is actually 11.8 inch.
How many chips are in a 300mm wafer?